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WSJ: Next iPhone to be thinner and lighter but more complicated to manufacture?

The Apple iPhone rumours continue to swirl. Citing “some suppliers of components to Apple,” The Wall Street Journal is reporting that the next iPhone will be thinner and lighter than the iPhone 4 and come with an 8MP camera. It will also use wireless baseband chips from Qualcomm rather than the Infineon chips found in the current iPhone 4. One […]